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IHW30N120R Soft Switching Series q C IGBT with monolithic body diode for soft switching Applications Features: * Powerful monolithic Body Diode * Specified for TJmax = 175C * Trench and Fieldstop technology for 1200 V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior * NPT technology offers easy parallel switching capability due to positive temperature coefficient in VCE(sat) * Low EMI 1 * Qualified according to JEDEC for target applications * Pb-free lead plating; RoHS compliant Applications: * Inductive Cooking * Soft Switching Applications Type IHW30N120R VCE 1200V IC 30A VCE(sat),Tj=25C 1.55V Tj,max 175C Marking H30R120 Package PG-TO-247-3-21 G E PG-TO-247-3-21 Maximum Ratings Parameter Collector-emitter voltage DC collector current TC = 25C TC = 100C Pulsed collector current, tp limited by Tjmax Turn off safe operating area (VCE 1200V, Tj 175C) Diode forward current TC = 25C TC = 100C Diode pulsed current, tp limited by Tjmax Diode surge non repetitive current, tp limited by Tjmax TC = 25C, tp = 10ms, sine halfwave TC = 25C, tp 2.5s, sine halfwave TC = 100C, tp 2.5s, sine halfwave Gate-emitter voltage Transient Gate-emitter voltage (tp < 5 ms) Power dissipation TC = 25C Operating junction temperature Storage temperature Soldering temperature, 1.6mm (0.063 in.) from case for 10s Ptot Tj Tstg IFpul s IFSM Symbol VCE IC Value 1200 60 30 90 90 Unit V A ICpul s IF 50 25 75 50 130 120 20 25 395 -40...+175 -55...+175 260 W C V VGE 1 J-STD-020 and JESD-022 1 Rev. 2.2 May 06 Power Semiconductors IHW30N120R Soft Switching Series Thermal Resistance Parameter Characteristic IGBT thermal resistance, junction - case Diode thermal resistance, junction - case Thermal resistance, junction - ambient Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Static Characteristic Collector-emitter breakdown voltage Collector-emitter saturation voltage V ( B R ) C E S V G E = 0V , I C = 5 00 A VCE(sat) V G E = 15 V , I C = 30 A T j =2 5 C T j =1 2 5 C T j =1 7 5 C Diode forward voltage VF V G E = 0V , I F = 1 5 A T j =2 5 C T j =1 2 5 C T j =1 7 5 C Gate-emitter threshold voltage Zero gate voltage collector current VGE(th) ICES I C = 0. 7m A, VCE=VGE V C E = 12 0 0V, V G E = 0V T j =2 5 C T j =1 7 5 C Gate-emitter leakage current Transconductance Integrated gate resistor Dynamic Characteristic Input capacitance Output capacitance Reverse transfer capacitance Gate charge Internal emitter inductance measured 5mm (0.197 in.) from case Ciss Coss Crss QGate LE V C E = 25 V , V G E = 0V , f= 1 MH z V C C = 96 0 V, I C =3 0 A V G E = 15 V 13 nH 2573 76 17 197 nC pF IGES gfs RGint V C E = 0V , V G E =2 0 V V C E = 20 V , I C = 30 A 26 None 5 2500 100 nA S 5.1 1.3 1.35 1.4 5.8 1.5 6.4 A 1.55 1.75 1.85 1.75 1200 V Symbol Conditions Value min. Typ. max. Unit RthJA 40 RthJCD 0.37 RthJC 0.38 K/W Symbol Conditions Max. Value Unit q Power Semiconductors 2 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q Switching Characteristic, Inductive Load, at Tj=25 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =2 5 C , V C C = 60 0 V, I C = 3 0 A V G E = 0 /1 5 V, R G = 34 , 1) L = 18 0 nH , 2) C = 3 9p F Energy losses include "tail" and diode reverse recovery. 71 37 1007 45 2.9 2.9 mJ ns Symbol Conditions Value min. typ. max. Unit Switching Characteristic, Inductive Load, at Tj=175 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =1 7 5 C V C C = 60 0 V, I C = 3 0 A, V G E = 0 /1 5 V, R G = 3 4 , 2) L =1 8 0n H, 2) C = 3 9p F Energy losses include "tail" and diode 2 reverse recovery 67 54 1157 59 4.3 4.3 mJ ns Symbol Conditions Value min. typ. max. Unit 1 2 Leakage inductance L a n d Stray capacity C due to dynamic test circuit in Figure E. Diode used in this test is Diode of IDP30E120 3 Rev. 2.2 May 06 Power Semiconductors IHW30N120R Soft Switching Series q tp=1s 100A 80A TC=80C TC=110C IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 20s 10A 50s 60A 40A 200s 1A Ic 20A 1ms 10ms DC 0A 10Hz 100Hz 1kHz 10kHz 100kHz 1V 10V 100V 1000V f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency for hard switching (turn-off) (Tj 175C, D = 0.5, VCE = 600V, VGE = 0/+15V, RG = 34) VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. IGBT Safe operating area (D = 0, TC = 25C, Tj 175C;VGE=15V) 350W 300W 250W 200W 150W 100W 50W 0W 25C 50A IC, COLLECTOR CURRENT Ptot, DISSIPATED POWER 40A 30A 20A 10A 50C 75C 100C 125C 150C 0A 25C 50C 75C 100C 125C 150C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj 175C) TC, CASE TEMPERATURE Figure 4. DC Collector current as a function of case temperature (VGE 15V, Tj 175C) Power Semiconductors 4 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q 80A 70A VGE=20V 80A 70A VGE=20V 15V 13V 11V 9V 40A 30A 20A 10A 0V 1V 2V 3V 0A 0V 1V 2V 3V 4V 7V IC, COLLECTOR CURRENT 60A 50A 40A 30A 20A 10A 0A IC, COLLECTOR CURRENT VCE(sat), COLLECTOR-EMITT SATURATION VOLTAGE 15V 13V 11V 9V 7V 60A 50A VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristic (Tj = 25C) VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristic (Tj = 175C) 50A 2.5V IC=60A IC, COLLECTOR CURRENT 40A 2.0V IC=30A 30A 1.5V IC=15A 1.0V 20A TJ=175C 10A 25C 0.5V 0A 0V 2V 4V 6V 8V 0.0V -50C 0C 50C 100C 150C VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristic (VCE=20V) TJ, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V) Power Semiconductors 5 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q 1s td(off) 1s t, SWITCHING TIMES t, SWITCHING TIMES td(off) 100ns tf td(on) tr 10ns 100ns tf tr td(on) 10A 20A 30A 40A 50A 10 20 30 40 50 60 70 0A IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, TJ=175C, VCE=600V, VGE=0/15V, RG=34, Dynamic test circuit in Figure E) RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, TJ=175C, VCE=600V, VGE=0/15V, IC=30A, Dynamic test circuit in Figure E) VGE(th), GATE-EMITT TRSHOLD VOLTAGE 1s td(off) 6V t, SWITCHING TIMES 5V max. typ. 4V min. 100ns tf td(on) tr 0C 50C 100C 150C 3V 2V -50C 0C 50C 100C 150C TJ, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=30A, RG=34, Dynamic test circuit in Figure E) TJ, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.7mA) Power Semiconductors 6 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q 8mJ 5 mJ E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES 6mJ 4 mJ 3 mJ 4mJ Eoff 2 mJ 2mJ Eoff 1 mJ 0mJ 10A 20A 30A 40A 50A 0 mJ 5 10 20 30 40 50 60 70 IC, COLLECTOR CURRENT Figure 13. Typical turn-off energy as a function of collector current (inductive load, TJ=175C, VCE=600V, VGE=0/15V, RG=34, Dynamic test circuit in Figure E) RG, GATE RESISTOR Figure 14. Typical turn-off energy as a function of gate resistor (inductive load, TJ=175C, VCE=600V, VGE=0/15V, IC=30A, Dynamic test circuit in Figure E) 4mJ 5mJ E, SWITCHING ENERGY LOSSES 3mJ E off 2mJ E, SWITCHING ENERGY LOSSES 4mJ 3mJ Eoff 2mJ 1mJ 1mJ 0mJ 50C 100C 150C 0mJ 400V 500V 600V 700V 800V TJ, JUNCTION TEMPERATURE Figure 15. Typical turn-off energy as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=30A, RG=34, Dynamic test circuit in Figure E) VCE, COLLECTOR-EMITTER VOLTAGE Figure 16. Typical turn-off energy as a function of collector emitter voltage (inductive load, TJ=175C, VGE=0/15V, IC=30A, RG=34, Dynamic test circuit in Figure E) Power Semiconductors 7 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q Ciss 1nF VGE, GATE-EMITTER VOLTAGE 240V 960V c, CAPACITANCE 10V 100pF Coss 5V Crss 0V 10pF 0nC 50nC 100nC 150nC 200nC 250nC 0V 10V 20V QGE, GATE CHARGE Figure 17. Typical gate charge (IC=30 A) VCE, COLLECTOR-EMITTER VOLTAGE Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE=0V, f = 1 MHz) ZthJC, TRANSIENT THERMAL RESISTANCE D=0.5 ZthJC, TRANSIENT THERMAL RESISTANCE D=0.5 -1 10 K/W 0.2 0.1 0.05 0.02 R,(K/W) 0.1221 0.1241 0.0977 0.0248 R1 10 K/W -1 0.2 0.1 0.05 0.02 0.01 R,(K/W) 0.1746 0.118 0.0855 R1 , (s) 2.98*10-2 3.2*10-3 3.15*10-4 R2 10 K/W -2 0.01 , (s) 6.16*10-2 6.91*10-3 5.43*10-4 3.12*10-5 R2 single pulse single pulse 10 K/W 10s -2 C 1 = 1 /R 1 C 2 = 2 /R 2 C 1 = 1 /R 1 C 2 = 2 /R 2 100s 1ms 10ms 100ms 1s 10s 100s 1ms 10ms 100ms tP, PULSE WIDTH Figure 19. IGBT transient thermal resistance (D = tp / T) tP, PULSE WIDTH Figure 20. Typical Diode transient thermal impedance as a function of pulse width (D=tP/T) Power Semiconductors 8 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q 1.5V I =20A F 20A VF, FORWARD VOLTAGE IF, FORWARD CURRENT TJ=25C 175C 10A 7.5A 1.0V 10A 0.5V 0A 0V 1V 0.0V -50C 0C 50C 100C 150C VF, FORWARD VOLTAGE Figure 21. Typical diode forward current as a function of forward voltage TJ, JUNCTION TEMPERATURE Figure 22. Typical diode forward voltage as a function of junction temperature Power Semiconductors 9 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q PG-TO247-3-21 Power Semiconductors 10 Rev. 2.2 May 06 IHW30N120R Soft Switching Series i,v diF /dt tr r =tS +tF Qr r =QS +QF IF tS QS tr r tF 10% Ir r m t VR q Ir r m QF dir r /dt 90% Ir r m Figure C. Definition of diodes switching characteristics 1 Tj (t) p(t) r1 r2 2 n rn r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure B. Definition of switching losses Figure E. Dynamic test circuit Leakage inductance L =180nH an d Stray capacity C =39pF. Power Semiconductors 11 Rev. 2.2 May 06 IHW30N120R Soft Switching Series q Edition 2006-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 5/10/06. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors 12 Rev. 2.2 May 06 |
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